Brands：
Nordson Cyberoptics
Airborne Particle Sensor (APS)
• Quickly monitors, identifies and enables troubleshooting of airborne particles down to 0.14um within semiconductor process equipment and automated material handling systems.
• Easily identifies when and where the particles originate and measures the effectiveness of cleaning adjustments and repairs in real-time.
• Includes CyberSpectrum™ software.
Auto Teaching System (ATS)
• Sees”inside equipment to capture three dimensional offset data(x, y, and z) to quickly teach wafer transfer positions with accuracy to 100um.
• Improves yields and lowers particulate contamination with accurate wafer hand-off calibration, proper alignment and set ups.
Auto Vibration System (AVS)
• Monitors 3-axis accelerations and vibration to enable yield improvements by maximizing acceleration and minimizing vibration.
• Records vibration data for easy comparison between past and present, as well as one tool to another, to reduce particles, maintenance time and cycle time.
Auto Gapping System (AGS)
• Speeds non-contact gap measurements and parallelism adjustments under vacuum for semiconductor processes such as thin-film deposition, sputtering and etch.
• Improves uniformity, tool availability and repeatability.
Auto Leveling System Vertical (ALS/ALS2V)
• Speeds setting the right inclination by measuring pitch, roll, rise overrun and vertical inclinations.
• Quickly and accurately enables setting the same level across the tools for better process uniformity.
Wafer Mapping Sensor
EX-Q/EX-QS
Wafer mapping sensor offers quick and reliable detection of semiconductor wafers and slotting errors in cassettes or FOUPs. This off-the-shelf sensor has ample detection headroom (sensitivity) allowing it to easily detect thin and dark-coated wafers of any size. It also has no moving parts that could result in particulate contamination.
EX-Q EX-QS
Auto Resistance Sensor (ARS)
• Shorten equipment maintenance cycles with wafer-like 4-wire resistance sensor.
• Predict when a tool needs maintenance with quantitative analysis of measured mean resistance over time.
• Improve cell-to-cell process uniformity with objective and repeatable resistance measurement.
• Includes CyberSpectrum™ software.
Auto Vibration and Leveling Sensor (AVLS3)
• Speed equipment qualification with wireless measurements.
• Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.
• Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.
• Includes CyberSpectrum™ Software.
Auto Multi Sensor (AMS)
• Speed equipment qualification with wireless measurements.
• Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.
• Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.
• Includes CyberSpectrum™ software.
ReticleSense-Airborne Particle Sensor (APSR/APSRQ)
• Quickly monitors, identifies and enables troubleshooting of airborne particles down to 0.14um within semiconductor process equipment and automated material handling systems.
• Easily identifies when and where the particles originate and measures the effectiveness of cleaning adjustments and repairs in real-time.
ReticleSense-Auto Multi Sensor (AMSR)
• Speed equipment qualification with wireless measurements.
• Shorten equipment maintenance cycles with reticle-like form factor.
• Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.
